DoD Awards $25.8M to Boost U.S. Radiation-Hardened Microchips

U.S. Department of Defense

The Department of Defense (DoD) announced today a $25.8 million award to Honeywell in Plymouth, Minnesota to produce or acquire trusted strategic radiation-hardened microelectronics. The Defense Production Act Investment (DPAI) award provides an assured capability of essential DoD components for operation in radiation environments. This effort supports the 2024 National Defense Industrial Strategy to expand domestic production and increase supply chain resilience.

"The DoD requires trusted and reliable radiation-hardened microelectronic and subcomponents to support strategic and space missions," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "This project ensures components are available to meet demand for current and future U.S. systems."

The funds will be used for strategic radiation-hardened microelectronics fabrication via a Defense Microelectronics Activity-accredited manufacturing process and support 90nm technology development in Honeywell's Minnesota microelectronics foundry.

The DPAI office has issued more than 50 program awards across multiple areas totaling $514.4 million since the beginning of fiscal year 2024. DPAI is overseen by the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) program in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.

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